SMT Assembly

Fast-turn SMT assembly that keeps NPI on schedule

High-mix SMT lines tuned for speed: 01005 passives, 0.3 mm pitch BGA, QFN, and fine-pitch connectors — with SPI, AOI, and X-ray inspection on every fast-turn smt build.

Reflow soldering line for fast-turn SMT assembly
Package handling

SMT capability highlights

CapabilitySpecification
Min passive package01005 (0402 metric)
Min BGA pitch0.3 mm
QFP / QFN pitch0.3 mm
Placement accuracy±25 μm @ Cpk 1.0
Component range0201–56 mm, odd-form supported
Board size50 × 50 mm – 510 × 460 mm
Board typesRigid, flex, rigid-flex, metal-core
InspectionSPI, AOI, X-ray (BGA/QFN)
Prototype to production

One process, any volume

Prototype SMT

3–5 day turns with framed stencils, first-article inspection, and photo documentation of every build.

Low-volume Production

High-mix lines with offline programming keep changeovers fast and pricing sane at 100–5,000 pieces.

Volume Production

Locked reflow profiles, golden samples, and statistical process control for repeat orders at scale.

Quality assurance

Inspection at every gate

  • SPI — solder paste volume and alignment verified before placement.
  • First-article inspection — every new build validated against BOM and assembly drawing.
  • AOI — 100% optical inspection for presence, polarity, and solder quality.
  • X-ray — hidden joints under BGA and QFN packages inspected and archived.
  • Functional test — fixtures and test procedures developed with your team.
AOI machine inspecting assembled PCBs

Need boards populated fast?

Fast-turn SMT with parts on hand in 3–5 days. Send your BOM and Gerbers for a quote within 24 hours.

sales@rctpcb.com · Engineering review within 24h · NDA on request