HDI PCB manufacturing for high-density designs
Laser-drilled microvias, sequential lamination, and 2/2 mil line-space capability — RCT builds HDI boards that escape 0.4 mm pitch BGAs without sacrificing reliability or schedule.
Fine-pitch manufacturing, controlled end to end
HDI compresses routing into fewer layers using stacked or staggered microvias — but only if plating, registration, and laser drilling are held to tight tolerances. Our HDI lines combine CO₂ and UV laser drilling with VCP filled plating for consistent via reliability.
- Stackups: 1+N+1, 2+N+2, 3+N+3, and any-layer (ELIC) structures.
- Microvias: 75 μm laser vias, copper-filled and capped for via-in-pad.
- Fine features: 2/2 mil trace/space, 0.25 mm BGA pitch escape.
- Registration: LDI imaging and X-ray target drilling for layer-to-layer accuracy.
Where our HDI boards work
Smartphones & Wearables
Any-layer designs where every square millimeter of routing counts.
Medical Devices
Compact, high-reliability interconnect for implantables-adjacent and diagnostic electronics.
Communications
High-speed modules combining HDI density with controlled impedance.
Computing & AI
Fine-pitch BGA and accelerator boards with stacked microvia escapes.
HDI capability summary
| Parameter | Specification |
|---|---|
| HDI structures | 1+N+1 / 2+N+2 / 3+N+3 / any-layer |
| Min laser microvia | 75 μm (3 mil) |
| Microvia fill | Copper filled & capped (VCP) |
| Min trace / space | 2 / 2 mil (50 μm) |
| Min BGA pitch | 0.25 mm |
| Sequential lamination | Up to 4 cycles |
| Quick-turn HDI | From 4 days (1+N+1) |
Escaping a fine-pitch BGA?
Send your package drawing and layer budget — we'll propose an HDI stackup and quote within 24 hours.