Flex PCB manufacturing for products that bend, fold, and move
Thin, lightweight, and built for dynamic bending — RCT's flex PCB lines produce single-sided to multilayer FPCs with fast-turn flex prototyping and full flex pcb assembly support.
What flex circuits make possible
Thin & Lightweight
Polyimide constructions down to 0.06 mm total thickness — routing signals where rigid boards can't fit.
Dynamic Bending
RA copper and correct bend-radius design deliver 100,000+ flex cycles in hinge and motion applications.
Compact Integration
Replace wire harnesses and connectors — fewer interconnects, fewer failure points, simpler assembly.
Fast-turn Prototyping
Flex prototypes in 72 hours, with DFM review that catches bend and coverlay issues before fabrication.
Where our flex circuits ship
- Consumer electronics — camera modules, display interconnects, foldable devices.
- Medical — wearable monitors, diagnostic probes, compact instrumentation.
- Automotive — LED lighting, sensor interconnects, battery management.
- Industrial & robotics — moving-axis cabling, print heads, encoder connections.
- Aerospace — weight-critical harness replacement with high reliability.
Flex fabrication summary
| Quality grade | Standard IPC Class II, IPC Class III |
|---|---|
| Number of layers | 1 – 12 layers |
| Order quantity | 1 pcs – 10,000+ pcs |
| Build time | 2 days – 5 weeks |
| Material | PI (Polyimide), LCP (Liquid Crystal Polymer) |
| Board size | Min 1 × 6 mm, Max 500 × 1200 mm |
| Board thickness | 0.1 mm – 0.8 mm |
| Copper weight (finished) | 0.5 oz – 4.0 oz |
| Min trace / space | 2 mil / 2 mil |
| Solder mask color | Green, white, blue, black, red, yellow |
| Coverlay | PI and PET film |
| Silkscreen color | White, black, yellow |
| Surface finish | ENIG (RoHS) · Immersion Tin (RoHS) · ENEPIG (soft bonding) · OSP (RoHS) |
| Min annular ring | 0.075 mm |
| Min mechanical drill hole | 0.01 mm |
| Min laser drill hole | 0.05 mm |
| Min hole size — punching (NPTH) | 0.5 mm |
| Dimension tolerance | ±0.05 mm |
| Other techniques | Peelable solder mask · Gold fingers · Copper-filled plating · EMI shielding (silver ink, silver film) · Stiffener (PI / FR-4 / SUS) |
Liquid Crystal Polymer flex for high-frequency signal integrity
When polyimide loses signal at 28 GHz and PTFE is too rigid to bend, RCT reaches for LCP. We build with Panasonic FELIOS LCP substrates (R-F705T / R-F705S) for the same reason 5G handset, 77 GHz automotive radar, and 112 Gbps PAM4 backplane designers do — and we tune the stackup so it lands cleanly in your enclosure.
| Property | Standard PI | Panasonic FELIOS LCP |
|---|---|---|
| Dk @ 10 GHz | 3.3 – 3.5 | 2.9 – 3.0 |
| Df @ 10 GHz | 0.003 – 0.008 | 0.0015 – 0.002 |
| Moisture absorption | 1.0 – 3.0 % | < 0.04 % |
| Frequency range | stable to ~10 GHz | stable to 100+ GHz |
| Max operating temp | 200 °C+ | 150 – 180 °C |
| Best for | Low-speed signal, dynamic flex | 5G / mmWave / RF / high-speed |
Where RCT ships LCP flex
- 5G mmWave antenna modules — sub-6 and 28 / 39 GHz phased arrays in handsets, CPE, small cells.
- Automotive 77 GHz radar — ADAS corner / long-range radar with controlled-impedance LCP feeds.
- High-speed 112 Gbps PAM4 backplanes — on-package and inter-board interconnects for AI accelerators.
- Wearables & medical patches — low-loss, biocompatible flex that survives skin contact and sweat.
- Aerospace & satellite RF — Ku / Ka band down-converter links where every 0.1 dB counts.
Flex & Rigid-Flex PCB samples
A selection of recent builds from our Shenzhen fab — scroll horizontally to see more.
Need a 28 GHz flex that actually ships?
Send your stackup, impedance target, and bend-radius spec — we'll propose an LCP or hybrid LCP / PI build and quote within 24 hours.