PCB assembly capability
Package support, assembly processes, test coverage, and volume range for our SMT, THT, and turnkey lines.
SMT & THT specifications
| Capability | Specification |
|---|---|
| Min passive package | 01005 (0402 metric) |
| BGA support | 0.3 mm pitch, up to 2,500+ balls, microBGA |
| QFN support | 0.35 mm pitch, thermal-pad voiding control by X-ray |
| QFP support | 0.3 mm pitch |
| Connectors & odd-form | Fine-pitch FPC/FFC, press-fit, board-to-board |
| THT capability | Wave, selective, and manual soldering; press-fit |
| Mixed assembly | SMT + THT single and double-sided, selective pallets |
| Flex pcb assembly | Dedicated carriers, low-temp profiles, stiffener handling |
| Board size range | 50 × 50 mm – 510 × 460 mm |
| Placement accuracy | ±25 μm @ Cpk 1.0 |
| Volume range | 1 pc engineering samples – 50k+ pcs/month |
Testing & inspection methods
SPI
3D solder paste inspection before placement — volume, area, and alignment on every pad.
AOI
Pre- and post-reflow automated optical inspection for presence, polarity, tombstoning, and solder defects.
X-Ray
BGA, QFN, and hidden-joint inspection with voiding analysis; images archived per lot.
ICT & Flying Probe
In-circuit test fixtures for production; flying probe for prototypes and low volume without tooling cost.
Functional Test
Custom FCT developed with your team — firmware flashing, boundary scan, and end-of-line validation.
Engineering Support
DFA review, stencil design, reflow profiling, and failure analysis feedback loops on every program.
Assembly equipment highlights
Reflow Lines
AOI Inspection
Stiffener Bonding
2D Metrology
Plasma Cleaning
RoHS Verification
FPC Depaneling
Auto PlatingPut these capabilities to work
Send Gerbers + BOM for a DFA review and quotation within 24 hours.