Capabilities / Fabrication

PCB fabrication capability

The complete fabrication envelope for rigid, flex, rigid-flex, and HDI boards. Values below are production-proven, not theoretical maxima.

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RCT PCB factory tour — production lines and equipment

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Core fabrication specifications

Parameter	Standard	Advanced
Layer count	2 – 16	Up to 40
Board types	Rigid, flex (1–4L), rigid-flex	HDI any-layer, multilayer flex (8L), metal-core, high-frequency
Materials	FR-4 Tg130/150/170, polyimide	Rogers RO4000/3000, Isola, halogen-free, adhesiveless PI
Copper thickness (outer)	0.5 – 2 oz	Up to 6 oz (heavy copper)
Copper thickness (inner)	0.5 – 1 oz	Up to 4 oz
Min mechanical hole	0.20 mm	0.15 mm
Min laser microvia	0.10 mm	0.075 mm, copper filled
Min trace / space	3 / 3 mil	2 / 2 mil
Board thickness (rigid)	0.3 – 3.2 mm	0.1 – 6.0 mm
Flex thickness	0.06 – 0.3 mm	Per stackup design
Max board size	500 × 600 mm	On request
Min board size	5 × 5 mm	—
Aspect ratio	10:1	12:1
Hole position tolerance	±0.075 mm	±0.05 mm
Outline tolerance	±0.10 mm	±0.05 mm (routing)
Impedance tolerance	±10%	±5%
Registration (layer-to-layer)	±75 μm	±50 μm

Surface finishes

Finish	Best for	Notes
ENIG	Fine pitch, wire bonding, general use	Default recommendation; flat, RoHS, long shelf life
ENEPIG	Gold wire bonding, high reliability	Universal finish for demanding applications
Lead-free HASL	Cost-driven standard boards	Not recommended below 0.5 mm pitch
Immersion silver	RF, fine pitch, aluminum wire bonding	Handle with care — tarnish-sensitive
Immersion tin	Press-fit, fine pitch	Shorter shelf life; plan build timing
OSP	Low cost, single reflow cycle	Best for quick consumption
Hard gold	Edge connectors, keypads, wear surfaces	Up to 50 μ″ on contact areas

Special processes

Blind & buried viasVia-in-pad (filled & capped)Sequential laminationEdge plating / castellationControlled-depth drillingCountersink / counterborePeelable maskCarbon inkEmbedded resistorsBook-binder rigid-flex