Multilayer PCB
Multilayer PCB manufacturing engineered for signal performance
From 4-layer control boards to 40-layer backplanes, RCT builds multilayer boards with stackup engineering, controlled impedance, and lamination processes tuned for reliability.
Multilayer expertise
Stackup support from real engineers
Multilayer performance is decided before layout ends — in the stackup. Our engineers help you choose dielectric thicknesses, copper weights, and plane assignments that hit your impedance and EMC targets without over-engineering cost.
- Controlled impedance ±10% (±5% on request) with TDR verification and test coupons.
- Blind, buried, and via-in-pad structures with filled and capped vias for fine-pitch escape routing.
- Sequential lamination for HDI and high-layer-count designs.
- Warpage control through balanced copper and symmetric stackup review.
- High-Tg, halogen-free, and low-loss materials from Shengyi, Isola, and Rogers.
Capability table
Multilayer fabrication envelope
| Parameter | Specification |
|---|---|
| Layer count | 4 – 40 layers |
| Max board thickness | 6.0 mm |
| Min dielectric | 0.06 mm (2.4 mil) |
| Impedance tolerance | ±10% standard / ±5% advanced |
| Aspect ratio | 12:1 mechanical / 1:1 laser microvia |
| Registration | ±50 μm layer-to-layer |
| Lamination cycles | Up to 4 sequential |
| Reliability | IPC-6012 Class 2 / Class 3 on request |
Planning a multilayer design?
Send your layer count and impedance targets — our engineers will propose a manufacturable stackup with your quote.
sales@rctpcb.com · Engineering review within 24h · NDA on request