Transparent capabilities, verified by equipment
Engineers don't trust adjectives — they trust specs. Here is exactly what our fabrication and assembly lines can hold, plus the DFM, turnaround, and QA systems behind them.
PCB Fabrication Capability
Layer counts, board types, materials, copper weights, hole sizes, trace/space, finishes, tolerances, and board sizes — the complete fabrication envelope.
View fabrication specs →
Assembly Capability
SMT package support, BGA/QFN/QFP, THT, mixed assembly, test and inspection methods, volume range, and engineering support.
View assembly specs →DFM, turnaround, and QA
DFM Report Explained
Every quote includes a manual DFM report: manufacturability risks ranked by severity, stackup verification, and specific fix recommendations — not an auto-generated error dump.
Turnaround Options
24h–72h fast-turn on standard structures, 5-day rigid-flex, and scheduled production slots for repeat orders. Committed dates, not estimates.
QA Systems
ISO 9001 quality system, IPC-A-600/610 Class 2–3 workmanship, RoHS verification by EDXRF, and full inspection records per lot.
CO₂ Laser Drilling
Plasma Cleaning
RoHS Verification
Precision FPC CuttingNot sure if your design fits our envelope?
Send the files — if something is at the edge of capability, our engineers will tell you honestly and propose alternatives.