Data integrated from the latest PCB capability workbook. Final manufacturability depends on file review, stackup, material availability, and production requirements.
Capability Item
Rigid PCB
Flex PCB
HDI PCB
Rigid-flex PCB
Layer
2-40
1-16
2-24 layers
2-28 layers
Min trace / space
2 mil / 2 mil
2 mil / 2 mil
2 mil / 2 mil
3 mil / 3 mil
Min hole
Laser-drilled: 0.075 mmMechanical: 0.2 mm
Laser drilling: 3 milMechanical drilling: 4 mil
2.5 mil
5 mil
Laminate
FR-4High TGHalogen-free
PolyimideDuPont Kapton & PyraluxPanasonic FELIOS
FR-4High TGHalogen-free
DuPont AP8535, AP8545Panasonic RF775, RF777
Min annular ring
50 um
–
–
5 mil
Max size
546 mm x 622 mm
20" x 40"
609 x 889 mm
500 mm x 1000 mm
Final thickness
0.3 mm-3.5 mm
0.12 mm-0.4 mm
0.3 mm-3.5 mm
0.2 mm-7 mm
Finish treatment
HASL, ENIG, hard gold, gold fingers, lead-free HASL
Lead-free HASLOSPENIG
HASL, ENIG, hard gold, gold fingers, lead-free HASL