High-density Interconnect
HDI PCB
HDI PCB support for fine-pitch, high-density, and compact electronics where routing space and reliability both matter.
Engineering-led PCB and PCBA support
RCT Advantage
HDI process support.
High-density layouts need careful review of via structures, line width, spacing, stackup, and fabrication feasibility.
Fine-pitch layouts
Support compact components and dense routing areas.
Microvia discussion
Review HDI requirements and structure options by project.
Stackup planning
Balance electrical, mechanical, and production constraints.
Manufacturing review
Clarify process risks before quote and build.
Capability Snapshot
Technical details for sourcing review.
Use this as a starting point for engineering discussion. Final capability depends on design data and manufacturing review.
Use cases
Fine-pitch, compact, high-density electronics
Review items
Microvias, stackup, trace/space, pad design
Assembly pairing
SMT and turnkey PCBA available
Support
Prototype and production planning by review
RCT Advantage
Where HDI PCB fits.
HDI can help reduce board area and support advanced electronics packaging.
Handheld devices
Compact products with dense component placement.
IoT modules
Small connected boards with tight routing needs.
Display products
Fine-pitch and flexible interconnect requirements.
Advanced assemblies
BGA, QFN, and high-density SMT programs.
FAQ
Buyer questions, answered clearly
Yes. RCT can coordinate fabrication, BOM review, component sourcing, SMT/THT assembly, inspection, and delivery for prototype and low-volume projects.
Gerber ZIP, drill files, stackup notes, drawings, BOM, pick-and-place data, and any special test or lead-time requirements are helpful.
Yes. The team can review manufacturability risks, stackup concerns, assembly constraints, and practical production notes before build.
Request HDI PCB support.
Send your files and schedule target. RCT will review manufacturability, quote requirements, and the best route forward.